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j une 2008 order number: e35965-001 the intel ? desktop board DP45SG may contain design defects or errors known as errata that may cause the product to deviate from published specifications. current characterized errata are documented in the in tel desktop board DP45SG specification update. intel? desktop board DP45SG technical product specification
revision history revision revision history date -001 first release of the intel ? desktop board DP45SG technical product specification june 2008 this product specification applies to only the standard intel ? desktop board DP45SG with bios identifier sgp4510h.86a. changes to this specification will be published in the intel desktop board DP45SG specification update before being incorporated into a revision of this document. information in this document is pr ovided in connection with intel ? products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. exce pt as provided in intel?s term s and conditions of sale for such products, intel assumes no liability what soever, and intel disclaims any express or implied warranty, relating to sale and/or us e of intel products in cluding liability or warranties relating to fitness for a particul ar purpose, merchantabi lity, or infringement of any patent, copyright or other intellectual property right. unle ss otherwise agreed in writing by intel, the intel pr oducts are not designed nor in tended for any application in which the failure of the intel product could cr eate a situation where personal injury or death may occur. all intel ? desktop boards are evaluated as information tec hnology equipment (i.t.e.) for use in personal computers (pc) for installation in homes, offices, schools, computer rooms, and similar locations. the suitability of this product for other pc or embedded non-pc applications or other environments, such as medical, industrial, alarm systems, te st equipment, etc. may not be suppo rted without further evaluation by intel. intel corporation may have patents or pending pate nt applications, trademar ks, copyrights, or other intellectual property rights that relate to the pres ented subject matter. the furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. intel may make changes to specifications and pr oduct descriptions at any time, without notice. designers must not rely on the absence or characteristi cs of any features or instru ctions marked ?reserved? or ?undefined.? intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. intel desktop boards may contain desi gn defects or errors known as errata, which may cause the product to deviate from published specifications. current ch aracterized errata are available on request. contact your local intel sales office or your distributor to obtain the latest specifications before placing your product order. copies of documents which have an ordering number and are referenced in this document, or other intel literature, may be obtained from: intel corporation p.o. box 5937 denver, co 80217-9808 or call in north america 1-800-548-4725, europe 44-0-1793-431-155, france 44-0-1793-421-777, germany 44-0-1793-421-333, other countries 708-296-9333. intel, the intel logo, pentium, core, and celeron are registered trademarks of intel corporation in the united states and other countries. * other names and brands may be cl aimed as the property of others. copyright ? 2008, intel corporation. all rights reserved.
iii preface this technical product specification (tps) specifies the board layout, components, connectors, power and environmental requirements, and the bios for the intel ? desktop board DP45SG. intended audience the tps is intended to provide detailed, technical information about the intel desktop board DP45SG and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. it is specifically not intended for general audiences. what this document contains chapter description 1 a description of the hardware used on the intel desktop board DP45SG 2 a map of the resources of the desktop board 3 the features supported by the bios setup program 4 a description of the bios error messages, beep codes, and post codes 5 regulatory compliance and battery disposal information typographical conventions this section contains information about the conventions used in this specification. not all of these symbols and abbreviations appear in all specifications of this type. notes, cautions, and warnings note notes call attention to important information. # integrator?s notes integrator?s notes are used to call attentio n to information that may be useful to system integrators. caution cautions are included to help you avoid damaging hardware or losing data.
intel desktop board DP45SG technical product specification iv other common notation # used after a signal name to identify an active-low signal (such as usbp0#) (nxnx) when used in the description of a component, n indicates component type, xn are the relative coordinates of its location on the intel desktop board DP45SG, and x is the instance of the particular part at that general location . for example, j5j1 is a connector, located at 5j. it is the first connector in the 5j area. gb gigabyte (1,073,741,824 bytes) gb/sec gigabytes per second gbits/sec gigabits per second kb kilobyte (1024 bytes) kbit kilobit (1024 bits) kbits/sec 1000 bits per second mb megabyte (1,048,576 bytes) mb/sec megabytes per second mbit megabit (1,048,576 bits) mbits/sec megabits per second xxh an address or data value ending with a lowercase h indicates a hexadecimal value. x.x v volts. voltages are dc unless otherwise specified. * this symbol is used to indicate third-party brands and names that are the property of their respective owners.
v contents 1 product desc ription .............................................................. 9 1.1 overview.......................................................................................... 9 1.1.1 feature summary .................................................................. 9 1.1.2 board layout ....................................................................... 11 1.1.3 block diagram ..................................................................... 13 1.2 legacy considerations............. ......................................................... 14 1.3 online support................................................................................ 14 1.4 processor ....................................................................................... 14 1.5 system memory .............................................................................. 15 1.5.1 memory configurations ......... ................................................ 16 1.6 intel ? p45 chipset ........................................................................... 18 1.6.1 pci express x16 graphics ...................................................... 18 1.6.2 usb ................................................................................... 19 1.6.3 serial ata interfaces ............................................................ 19 1.7 real-time clock subsystem ............ .................................................. 21 1.8 legacy i/o controller ....................................................................... 22 1.8.1 consumer infrared (cir) ....................................................... 22 1.9 audio subsystem............................................................................. 23 1.9.1 audio subsystem software .................................................... 23 1.9.2 audio connectors and headers ............................................... 24 1.10 lan subsystem ............................................................................... 25 1.10.1 intel ? 82567lf gigabit ethernet controller............................... 25 1.10.2 lan subsystem software....................................................... 26 1.10.3 rj-45 lan connector with integrated leds .............................. 26 1.11 hardware management subsystem .................................................... 27 1.11.1 hardware monitoring and fan control...................................... 27 1.11.2 fan monitoring ..................................................................... 27 1.11.3 chassis intrusion and detection.............................................. 27 1.11.4 thermal monitoring .............................................................. 28 1.12 power management ......................................................................... 29 1.12.1 acpi................................................................................... 29 1.12.2 hardware support ................................................................ 32 1.12.3 energy star* .................................................................... 36 2 technical re ference ............................................................ 37 2.1 memory resources .......................................................................... 37 2.1.1 addressable memory............................................................. 37 2.1.2 memory map........................................................................ 39 2.2 connectors and headers................................................................... 39 2.2.1 back panel connectors .......................................................... 40 2.2.2 component-side connectors and headers ................................ 41 2.3 jumper block .................................................................................. 51 2.4 mechanical considerations ........... ..................................................... 52
intel desktop board DP45SG technical product specification vi 2.4.1 form factor......................................................................... 52 2.5 electrical considerations ........... ........................................................ 53 2.5.1 power supply considerations ................................................. 53 2.5.2 fan header current capability................................................ 54 2.5.3 add-in board considerations .. ................................................ 54 2.6 thermal considerations .................................................................... 54 2.7 reliability ....................................................................................... 57 2.8 environmental ................................................................................ 57 3 overview of bi os features ................................................. 59 3.1 introduction ................................................................................... 59 3.2 bios flash memory organization .. ..................................................... 60 3.3 resource configuration ............ ........................................................ 60 3.3.1 pci autoconfiguration ........................................................... 60 3.4 system management bios (smbios)................................................. 61 3.5 legacy usb support ........................................................................ 61 3.6 bios updates ................................................................................. 62 3.6.1 language support ................................................................ 62 3.6.2 custom splash screen .......................................................... 63 3.7 bios recovery................................................................................ 63 3.8 boot options................................................................................... 64 3.8.1 cd-rom boot ...................................................................... 64 3.8.2 network boot....................................................................... 64 3.8.3 booting without attached devices........................................... 64 3.8.4 changing the default boot device during post ........................ 64 3.9 adjusting boot speed....................................................................... 65 3.9.1 peripheral selection and conf iguration..................................... 65 3.9.2 bios boot optimizations ....... ................................................ 65 3.10 bios security features .................................................................... 66 4 error messages an d beep codes ......................................... 67 4.1 speaker ......................................................................................... 67 4.2 bios beep codes ............................................................................ 67 4.3 bios error messages ....................................................................... 67 4.4 port 80h post codes ....................................................................... 68 5 regulatory compliance and battery disposal information .. 73 5.1 regulatory compliance..................................................................... 73 5.1.1 safety standards.................................................................. 73 5.1.2 european union declaration of conformity statement ................ 74 5.1.3 product ecology statements................................................... 75 5.1.4 emc regulations .................................................................. 79 5.1.5 product certification markings (b oard level)............................. 80 5.2 battery disposal information........ ..................................................... 81
contents vii figures figure 1. major board components.... ........................................................... 11 figure 2. block diagram............... ............................................................... 13 figure 3. memory channel and dimm configuration ........................................ 17 figure 4. back panel audio connector options................................................ 24 figure 5. lan connector led locations ......................................................... 26 figure 6. thermal sensors and fan headers .................................................. 28 figure 7. location of the standby power indicator led .................................... 36 figure 8. detailed system memory a ddress map............................................. 38 figure 9. back panel connectors .... .............................................................. 40 figure 10. component-side connectors and headers....................................... 41 figure 11. connection diagram for front panel header .................................... 48 figure 12. connection diagram for front panel usb headers............................ 50 figure 13. connection diagram for ieee 1394a header.................................... 50 figure 14. location of the jumper bl ock ........................................................ 51 figure 15. board dimensions ....................................................................... 52 figure 16. localized high temperature zones ................................................ 56 tables table 1. feature summary ............................................................................ 9 table 2. components shown in figure 1........................................................ 12 table 3. supported memory configurat ions.................................................... 15 table 4. audio jack retasking support .......................................................... 23 table 5. lan connector led states .............................................................. 26 table 6. effects of pressing the powe r switch................................................. 30 table 7. power states and targeted system power ......................................... 31 table 8. wake-up devices and events ........................................................... 32 table 9. system memory map...................................................................... 39 table 10. component-side connectors and headers shown in figure 10 ............ 42 table 11. hd audio link header................................................................... 43 table 12. front panel audio header .............................................................. 43 table 13. serial ata connectors .................................................................. 43 table 14. serial port header ......... ............................................................... 43 table 15. chassis intrusion header .............................................................. 44 table 16. front and rear chassis (3-pin) fan headers..................................... 44 table 17. processor and rear chassis 2 (4-pin) fan headers ............................ 44 table 18. s/pdif connector ........................................................................ 45 table 19. auxiliary front panel power/sleep led header ................................. 46 table 20. processor core power conne ctor .................................................... 46 table 21. main power connector .................................................................. 47 table 22. auxiliary pci express grap hics power.............................................. 47 table 23. front panel header....................................................................... 48 table 24. states for a one-color powe r led .................................................. 49 table 25. states for a two-color powe r led .................................................. 49 table 26. bios setup configuration jumper settings ...................................... 51 table 27. recommended power supply current values.................................... 53
intel desktop board DP45SG technical product specification viii table 28. fan header current capability ....................................................... 54 table 29. thermal considerations fo r components.......................................... 56 table 30. environmental specifications ......................................................... 57 table 31. bios setup program menu ba r ...................................................... 60 table 32. bios setup program functi on keys ................................................ 60 table 33. acceptable drives/media types for bios recovery ............................ 63 table 34. boot device menu options.. ........................................................... 64 table 35. supervisor and user passwor d functions ......................................... 66 table 36. beep codes................................................................................. 67 table 37. bios error messages .................................................................... 67 table 38. port 80h post code ranges .......................................................... 68 table 39. port 80h post codes...... .............................................................. 69 table 40. typical port 80h post sequ ence .................................................... 72 table 41. safety standards ......................................................................... 73 table 42. lead-free board markings ............................................................. 78 table 43. emc regulations .......................................................................... 79 table 44. product certification markin gs........................................................ 80
9 1 product description 1.1 overview 1.1.1 feature summary table 1 summarizes the major features of the board. table 1. feature summary form factor atx (11.60 inches by 9.60 inches [ 294.60 millimeters by 243.84 millimeters]) processor ? intel ? core?2 extreme processor in an lga775 socket ? intel ? core?2 quad processor in an lga775 socket ? intel ? core?2 duo processor in an lga775 socket ? intel ? pentium ? dual-core processor in an lga775 socket ? intel ? celeron ? dual-core processor in an lga775 socket ? intel ? celeron ? processor 400 sequence in an lga775 socket memory ? four 240-pin ddr3 sdram dual inline memory module (dimm) sockets ? support for ddr3 1333 mhz, ddr3 1066 mhz, and ddr3 800 mhz dimms ? support for up to 8 gb of system memory ? support for non-ecc memory chipset intel ? p45 chipset, consisting of: ? intel ? 82p45 memory controller hub (mch) ? intel ? 82801jr i/o controller hub (ich10r) audio 8-channel (7.1) audio subsystem using th e idt* 92hd73e high definition audio codec and dolby* home theater certification legacy i/o control legacy i/o controller for serial port header and consumer infrared (cir) peripheral interfaces ? twelve usb 2.0 ports: six back panel connectors and six front panel headers ? two ieee-1394a interfaces: one back panel connector and one front-panel header ? six serial ata (3 gbps) interfaces, incl uding one red-colored external serial ata (esata) interface on the back panel ? one serial port header (may require specialized chassis or cable for use) bios ? intel ? bios resident in the spi flash device ? support for advanced configuration and power interface (acpi), plug and play, and smbios instantly available pc technology ? support for pci local bus specification revision 2.2 ? support for pci express* revision 1.0a ? suspend to ram support ? wake on pci, front panel, cir, and usb ports lan support gigabit (10/100/1000 mbits/sec) lan subsystem using the intel ? 82567lf gigabit ethernet controller continued
intel desktop board DP45SG technical product specification 10 table 1. feature summary (continued) expansion capabilities ? three pci* conventional bus add-in card connectors (smbus routed to all pci conventional bus add-in card connectors) ? two pci express 2.0 x16 bus add-in card connectors ? two pci express x1 bus add-in card connector hardware monitor subsystem ? hardware monitoring and fan control asic ? voltage sense to detect out of range power supply voltages ? thermal sense to detect out of range thermal values ? four fan headers using pwm control ? four fan sense inputs used to monitor fan activity ? fan speed control using voltage contro l (3-pin fan headers front and rear) ? support for product environmen tal control interface (peci)
product description 11 1.1.2 board layout figure 1 shows the location of th e major components on the board. figure 1. major board components table 2 lists the components identified in figure 1.
intel desktop board DP45SG technical product specification 12 table 2. components shown in figure 1 item/callout from figure 1 descript ion a pci conventional bus add-in card connector b s/pdif connector c pci conventional bus add-in card connector d pci conventional bus add-in card connector e pci express x16 bus add-in card connector f pci express x1 bus add-in card connector g ieee 1394a front panel header h pci express x1 bus add-in card connector i pci express x16 us add-in card connector j auxiliary pci express graphics power k back panel connectors l processor fan header m rear chassis fan header n processor core power connector (2 x 2) o lga775 processor socket p intel 82p45 memory controller hub (mch) q dimm channel a sockets [2] r dimm channel b sockets [2] s main power connector t front chassis fan header u chassis intrusion header v bios setup configuration jumper block w auxiliary front panel power led header x intel 82801jr i/o controller hub (ich10r) y front panel header z front panel cir receiver (input) header aa serial ata connectors [5] bb speaker cc auxiliary chassis fan header dd front panel usb headers [3] ee high definition au dio link header ff battery gg serial header hh back panel cir emitter (output) header connector ii front panel audio header
product description 13 1.1.3 block diagram figure 2 is a block diagram of the majo r functional areas of the board. figure 2. block diagram
intel desktop board DP45SG technical product specification 14 1.2 legacy considerations this board differs from other intel deskto p board products, with specific changes including (but not limited to) the following: ? no parallel port ? no floppy drive connector ? no ps/2 connectors ? no pata connector 1.3 online support to find information about? visit this world wide web site: intel ? desktop board DP45SG http://www.intel.com/products/m otherboard/DP45SG/index.htm desktop board support http://support.intel.com/support/motherboards/desktop/DP45SG available configurations for the intel desktop board DP45SG http://www.intel.com/products/m otherboard/DP45SG/index.htm supported processors http://processormatch.intel.com/ chipset information http://www.intel.com/products/d esktop/chipsets/index.htm bios and driver updates http://downloadcenter.intel.com 1.4 processor the board is designed to suppo rt the following processors: ? intel core 2 extreme processor in an lga775 socket ? intel core 2 quad processor in an lga775 socket ? intel core 2 duo processor in an lga775 socket ? intel pentium dual-core processor in an lga775 socket ? intel celeron dual-core processor in an lga775 socket ? intel celeron processor 400 sequence in an lga775 socket see the intel web site listed below for the most up-to-date list of supported processors. for information about? refer to: supported processors for the board http://processormatch.intel.com/ caution use only the processors listed on the web site above. use of unsupported processors can damage the board, the proce ssor, and the power supply. # integrator?s note this board has specific requirements for pr oviding power to the processor. refer to section 2.5.1 on page 53 for information on power supply requirements for this board.
product description 15 1.5 system memory the board has four dimm sockets and su pports the following memory features: ? 1.5 v ddr3 sdram dimms with gold plated contacts, with the option to raise the voltage to support higher performance ddr3 sdram dimms ? dual channel interleaved mode support unbuffered, single-sided or double-sided dimms. ? 8 gb maximum total system memory. refer to section 2.1.1 on page 37 for i nformation on the total amo unt of addressable memory. ? minimum recommended total system memory: 256 mb ? non-ecc dimms ? serial presence detect ? ddr3 1333 mhz, ddr3 1066 mhz, and ddr3 800 mhz sdram dimms notes ? remove the video card in the primary pci express x16 before installing or upgrading memory to avoid interference with the memory retention mechanism. ? to be fully compliant with all applicab le ddr sdram memory specifications, the board should be populated with dimms th at support the serial presence detect (spd) data structure. this allows the bi os to read the spd data and program the chipset to accurately config ure memory settings for optimum performance. if non- spd memory is installed, the bios will a ttempt to correctly configure the memory settings, but performance and reliability may be impacted or the dimms may not function under the determined frequency. table 3 lists the supported dimm configurations. table 3. supported memory configurations dimm capacity configuration (note) sdram density sdram organization front-side/back-side number of sdram devices 256 mb ss 512 mbit 32 m x 16/empty 4 512 mb ss 512 mbit 64 m x 8/empty 8 512 mb ds 512 mbit 32 m x 16/32 m x 16 8 512 mb ss 1 gbit 64 m x 16/empty 4 1024 mb ds 512 mbit 64 m x 8/64 m x 8 16 1024 mb ss 1 gbit 128 m x 8/empty 8 1024 mb ds 1 gbit 64 m x 16/64 m x 16 8 2048 mb ds 1 gbit 128 m x 8/128 m x 8 16 note: in the second column, ?ds? refers to double-s ided memory modules (containing two rows of sdram) and ?ss? refers to single-sided memory modules (containing one row of sdram). for information about? refer to: tested memory http://support.intel.com/support/motherboards/desktop/sb/cs- 025414.htm
intel desktop board DP45SG technical product specification 16 1.5.1 memory configurations the intel 82p45 mch supports the followi ng types of memory organization: ? dual channel (interleaved) mode . this mode offers the highest throughput for real world applications. dual channel mode is enabled when the installed memory capacities of both dimm channels are equal. technology and device width can vary from one channel to the other but the inst alled memory capacity for each channel must be equal. if different speed dimms are used between channels, the slowest memory timing will be used. ? single channel (asymmetric) mode . this mode is equivalent to single channel bandwidth operation for real world applications. this mode is used when only a single dimm is installed or the memory capacities are unequal. technology and device width can vary from one channel to the other. if different speed dimms are used between channels, the slowest memory timing will be used. ? flex mode . this mode provides the most flex ible performance characteristics. the bottommost dram memory (the memory that is lowest within the system memory map) is mapped to dual channe l operation; the topmost dram memory (the memory that is nearest to the 8 gb address space limit), if any, is mapped to single channel operation. flex mode results in multiple zones of dual and single channel operation across the whole of dram memory. to use flex mode, it is necessary to popula te both channels. for information about? refer to: memory configuration examples http://www.intel.com/support/m otherboards/desktop/sb/cs- 011965.htm figure 3 illustrates the memory channel and dimm configuration. note the dimm 0 sockets of both channels are bl ue. the dimm 1 sockets of both channels are black.
product description 17 figure 3. memory channel and dimm configuration
intel desktop board DP45SG technical product specification 18 1.6 intel ? p45 chipset the intel p45 chipset consists of the following devices: ? intel 82p45 memory controller hub (mch) with direct media interface (dmi) interconnect ? intel 82801jr i/o controller hub (ich10r) the mch component provides interfaces to the processor, memory, and pci express. the ich10r is a centralized cont roller for the board?s i/o paths. for information about refer to the intel p45 chipset http://www.intel.com/products/d esktop/chipsets/index.htm resources used by the chipset chapter 2 1.6.1 pci express x16 graphics the mch supports two add-in discrete graphi cs card via the pci express 2.0 graphics connector: ? one primary pci express 2.0 x16 (electrica l x16 or x8) bus add-in card connector. the x16 interface supports simultaneous (full duplex) transfers up to 16 gbytes/sec when operating in x16 mode with a compatible pci express 2.0 x16 discrete graphics card. backwards compatible with pci express 1.1 x16, supporting a maximum theoretical bandwidth of 8 gb/s. interface will operate in x16 mode only if the secondary pci express x16 connector is not populated. ? one secondary pci express 2.0 x16 (electri cal x8) bus add-in card connector: the board provides a pci express add-in card connector in the form of a physical x16 connector with electrical routing of x8. this connector is an electrical equivalent of a pci express x8 bus add-in card connect or. this connector also supports x4 and x1 pci express add-in cards. this inte rface supports pci express 2.0 bandwidth when used with a compatible pci ex press 2.0 x16 discrete graphics card. for information about refer to pci express technology http://www.pcisig.com
product description 19 1.6.2 usb the board supports up to twelve usb 2.0 ports, supports uhci and ehci, and uses uhci- and ehci-compatible drivers. the ich10r provides the usb controller for all ports. the port arrangement is as follows: ? six ports are implemented with dual stacked back panel connectors adjacent to the audio connectors ? six ports are routed to three separate front panel usb headers for information about refer to the location of the usb connectors on the back panel figure 9, page 40 the location of the front panel usb headers figure 10, page 41 1.6.3 serial ata interfaces the board provides five serial ata (sata) connectors, which support one device per connector. the board also provides one re d-colored external serial ata (esata) connector on the back panel. 1.6.3.1 serial ata support the board?s serial ata controller offers six independent serial ata ports with a theoretical maximum transfer rate of 3 gbits/ sec per port. one device can be installed on each port for a maximum of six serial ata devices. a point-to-point interface is used for host to device connections, unlike parallel ata ide which supports a master/slave configuration an d two devices per channel. for compatibility, the underlying serial ata functionality is transparent to the operating system. the serial ata controlle r can operate in both legacy and native modes. in legacy mode, standard ide i/ o and irq resources are assigned (irq 14 and 15). in native mode, standard pci conv entional bus resource steering is used. native mode is the preferred mode for co nfigurations using the windows* xp and windows vista* operating systems. note many serial ata drives use new low-voltag e power connectors and require adapters or power supplies equipped with lo w-voltage power connectors. for more information, see: http://www.serialata.org/ . for information about refer to the location of the serial ata connectors figure 10, page 41
intel desktop board DP45SG technical product specification 20 1.6.3.2 serial ata raid the board supports intel matrix storage technology which provides the following raid (redundant array of independent drives) levels via the ich10r: ? raid 0 - data striping ? raid 1 - data mirroring ? raid 0+1 (or raid 10) - data striping and mirroring ? raid 5 - distributed parity note in order to use supported raid features, you must first enable raid in the bios. also, during microsoft windows xp installation, you must press f6 to install the raid drivers. see your microsoft windows xp documentation for more information about installing drivers during installation. 1.6.3.3 intel ? rapid recover technology the board incorporates the intel ? rapid recover technology (intel ? rrt). intel ? rapid recover technology is a feature of intel ? matrix storage manager. it uses raid 1 (mirroring) functionality to copy da ta from a designated master drive to a designated recovery drive. the master drive data can be copied to the recovery drive either continuously or on request. when using the continuous update policy, changes made to the data on the master drive while the recovery drive is disconnected or offline are automatically copied to the recovery drive when it is reconnected. when using the on request update policy, the master drive data can be restored to a pr evious state by copying the data on the recovery drive back to the master drive. for information about refer to intel? matrix storage and intel? rapid recovery technology http://www.intel.com/desi gn/chipsets/matrixstorage _sb.htm
product description 21 1.7 real-time clock subsystem a coin-cell battery (cr2032) powers the real-time clock and cmos memory. when the computer is not plugged into a wall so cket, the battery has an estimated life of three years. when the computer is plu gged in, the standby current from the power supply extends the life of the battery. the clock is accurate to 13 minutes/year at 25 oc with 3.3 vsb applied. note if the battery and ac power fail, custom defa ults, if previously saved, will be loaded into cmos ram at power-on. when the voltage drops below a certain leve l, the bios setup program settings stored in cmos ram (for example, the date and time) might not be accurate. replace the battery with an equivalent one. figure 1 on page 11 shows the location of the battery.
intel desktop board DP45SG technical product specification 22 1.8 legacy i/o controller the i/o controller provides the following features: ? consumer infrared (cir) headers ? serial irq interface compatible with serialized irq support for pci systems ? intelligent power management, including a programmable wake-up event interface ? pci power management support the bios setup program provides configuration options for the i/o controller. 1.8.1 consumer infrared (cir) the consumer infrared (cir) feature is desi gned to comply with microsoft consumer infrared usage models. microsoft windows vista is the supported operating system. the cir feature is made up of two separate pieces: the receiving (receiver) header, and the output (emitter) header. the receivin g header consists of a filtered translated infrared input compliant with microsoft cir specifications, and also a ?learning? infrared input. this learning input is simply a high pass input which the computer can use to ?learn? to speak the infrared communi cation language of other user remotes. the emitter header consists of two output ports which the pc can use to emulate ?learned? infrared commands in order to control external electronic hardware. customers are required to buy or create thei r own interface modules to plug into intel desktop boards for this feature to work.
product description 23 1.9 audio subsystem the onboard audio subsystem consists of the following: ? intel 82801jr (ich10r) ? idt 92hd73e audio codec ? back panel audio connectors ? component-side audio headers: ? intel ? high definition audio front panel header ? hd audio link header ? s/pdif connector the audio subsystem supports the following features: ? dolby home theater support ? a signal-to-noise (s/n) ratio of 95 db ? independent multi-streaming 7.1 audio (using the back panel audio connectors) and stereo (using the intel high definition audio front panel header). note systems built with ac 97 front panel will not be able to obtain the microsoft windows vista* logo after june 2007. table 4 lists the supported functions of the front panel and back panel audio jacks. table 4. audio jack retasking support audio jack supports micro- phone? supports line out? supports head- phones? supports line in / side surround ? supports rear surround ? supports center/ sub- woofer? front panel ? green no yes yes no no no front panel ? pink yes no no no no no back panel ? blue no no no yes no no back panel ? green no yes yes no no no back panel ? pink yes no no no no no back panel ? black no no no no yes no back panel - orange no no no no no yes 1.9.1 audio subsystem software audio software and drivers are availabl e from intel?s worl d wide web site. for information about refer to obtaining audio software and drivers section 1.3, page 14
intel desktop board DP45SG technical product specification 24 1.9.2 audio connectors and headers the board contains audio connectors and he aders on both the back panel and the component side of the board. the comp onent-side audio connectors include the following: ? front panel audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio connectors) ? high definition (hd) audio link header (a 2 x 8-pin header) used for compatible discrete graphic cards supporting hdmi ? s/pdif audio connector (a 1 x 3-pin head er) can be alternately used for discrete graphic cards supporting hdmi that do not have compatibility with the hd audio link header the back panel audio connectors are configur able through the audio device drivers. the available configurable audio ports are shown in figure 4. item description a rear surround left/right channel audio out b center channel and lfe (subwoofer) audio out c line in / side surround d line out e mic in f s/pdif digital audio out (optical) figure 4. back panel audio connector options for information about refer to the back panel audio connectors section 2.2.1, page 40 the location of the front panel audio header figure 1, page 11 the signal names of the front panel audio header table 12, page 43 the location of the hd audio link header figure 1, page 11 the signal names of the hd audio link header table 11, page 43
product description 25 1.10 lan subsystem the lan subsystem consists of the following: ? intel 82567lf gigabit ethernet co ntroller (10/100/1000 mbits/sec) ? intel 82801jr (ich10r) ? rj-45 lan connector with integrated status leds additional features of the lan subsystem include: ? csma/cd protocol engine ? lan connect interface between ich10r and the lan controller ? pci conventional bu s power management ? acpi technology support ? lan wake capabilities ? lan subsystem software for information about refer to lan software and drivers http://downloadcenter.intel.com 1.10.1 intel ? 82567lf gigabit ethernet controller the intel 82567lf gigabit ethernet contro ller supports the following features: ? pci express link ? 10/100/1000 ieee 802.3 compliant ? compliant to ieee 802.3x flow control support ? 802.1p and 802.1q ? tcp, ip, and udp checksum offload (for ipv4 and ipv6) ? transmit tcp segmentation ? full device driver compatibility ? pci express power management support
intel desktop board DP45SG technical product specification 26 1.10.2 lan subsystem software lan software and drivers are available from intel?s worl d wide web site. for information about refer to obtaining lan software and drivers http://downloadcenter.intel.com 1.10.3 rj-45 lan connector with integrated leds two leds are built into the rj-45 lan connector (shown in figure 5 below). item description a link led (green) b data rate led (green/yellow) figure 5. lan connector led locations table 5 describes the led states when the board is powered up and the lan subsystem is operating. table 5. lan connector led states led led color led state condition off lan link is not established. on lan link is established. link green blinking lan activity is occurring off 10 mbits/sec data rate is selected. green 100 mbits/sec data rate is selected. data rate green/yellow yellow 1000 mbits/sec data rate is selected.
product description 27 1.11 hardware management subsystem the hardware management features enable th e board to be compatible with the wired for management (wfm) specification. th e board has several hardware management features, including the following: ? fan monitoring and control ? thermal and voltage monitoring ? chassis intrusion detection 1.11.1 hardware monitoring and fan control the features of the hardware monitoring and fan control include: ? fan speed control controllers and sensors provided by the hardware monitoring and fan control asic ? thermal sensors in the processor, 82p45 mch, 82801jr ich10r, and remote thermal sensors ? power supply monitoring of five voltages (+5 v, +12 v, +3.3 v, +1.125 v, and +vccp) to detect levels above or below acceptable values ? thermally monitored closed-loop fan control, for all four fans, that can adjust the fan speed according to thermal conditions 1.11.2 fan monitoring fan monitoring can be implemented using intel ? desktop control center or third-party software. for information about refer to the functions of the fan headers section 1.12.2.2, page 33 1.11.3 chassis intrusion and detection the board supports a chassis security featur e that detects if the chassis cover is removed. the security feature uses a mechan ical switch on the chassis that attaches to the chassis intrusion header. when the chassis cover is removed, the mechanical switch is in the closed position. for information about refer to the location of the ch assis intrusion header figure 10, page 41
intel desktop board DP45SG technical product specification 28 1.11.4 thermal monitoring figure 6 shows the locations of th e thermal sensors and fan headers. item description a rear chassis fan b processor fan c thermal diode, located on processor die d thermal diode, located on the mch die e remote thermal diode f front chassis fan g thermal diode, located on the ich10r die h auxiliary chassis fan i hardware monitoring and fan control asic figure 6. thermal sensors and fan headers note the minimum thermal reporting threshold for the mch is 66 c. the mch thermal sensor will display 66 c until the temperature rises above this point.
product description 29 1.12 power management power management is implemented at several levels, including: ? software support through advanced conf iguration and power interface (acpi) ? hardware support: ? power connector ? fan headers ? lan wake capabilities ? instantly available pc technology ? wake from usb ? power management event sign al (pme#) wake-up support ? pci express wake# signal support 1.12.1 acpi acpi gives the operating system direct co ntrol over the power management and plug and play functions of a computer. the us e of acpi with this board requires an operating system that provides full acpi support. acpi features include: ? plug and play (including bus and device enumeration) ? power management control of individual devices, add-in boards (some add-in boards may require an acpi-aware driver), video displays, and hard disk drives ? methods for achieving less than 15-watt syst em operation in the power-on/standby sleeping state ? a soft-off feature that enables the operating system to power-off the computer ? support for multiple wake-up events (see table 8 on page 32) ? support for a front panel power and sleep mode switch
intel desktop board DP45SG technical product specification 30 table 6 lists the system states based on how long the power switch is pressed, dependi ng on how acpi is configured with an acpi-aware operating system. table 6. effects of pressing the power switch if the system is in this state? ?and the power switch is pressed for ?the system ente rs this state off (acpi g2/g5 ? soft off) less than four seconds power-on (acpi g0 ? working state) on (acpi g0 ? working state) less than four seconds soft-off/standby (acpi g1 ? sleeping state) on (acpi g0 ? working state) more than six seconds fail safe power-off (acpi g2/g5 ? soft off) sleep (acpi g1 ? sleeping state) less than four seconds wake-up (acpi g0 ? working state) sleep (acpi g1 ? sleeping state) more than six seconds power-off (acpi g2/g5 ? soft off) 1.12.1.1 system states and power states under acpi, the operating system direct s all system and device power state transitions. the operating system puts de vices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. devices that are not being used can be tu rned off. the operating system uses information from applications and user setti ngs to put the system as a whole into a low-power state.
product description 31 table 7 lists the power states supported by the board along with the associated system power targets. see the acpi specif ication for a complete description of the various system and power states. table 7. power states and targeted system power global states sleeping states processor states device states targeted system power (note 1) g0 ? working state s0 ? working c0 ? working d0 ? working state. full power > 30 w g1 ? sleeping state s1 ? processor stopped c1 ? stop grant d1, d2, d3 ? device specification specific. 5 w < power < 52.5 w g1 ? sleeping state s3 ? suspend to ram. context saved to ram. no power d3 ? no power except for wake-up logic. power < 5 w (note 2) g1 ? sleeping state s4 ? suspend to disk. context saved to disk. no power d3 ? no power except for wake-up logic. power < 5 w (note 2) g2/s5 s5 ? soft off. context not saved. cold boot is required. no power d3 ? no power except for wake-up logic. power < 5 w (note 2) g3 ? mechanical off ac power is disconnected from the computer. no power to the system. no power d3 ? no power for wake-up logic, except when provided by battery or external source. no power to the system. service can be performed safely. notes: 1. total system power is dependent on the system conf iguration, including add-in boards and peripherals powered by the system chassis? power supply. 2. dependent on the standby power consumption of wake-up devices used in the system.
intel desktop board DP45SG technical product specification 32 1.12.1.2 wake-up devices and events table 8 lists the devices or specific events that can wake the computer from specific states. table 8. wake-up devices and events these devices/events can wake up the computer? ?from this state lan s1, s3, s4, s5 (note 1) pme# signal s1, s3, s4, s5 (note 1) power switch s1, s3, s4, s5 rtc alarm s1, s3, s4, s5 usb s1, s3 wake# s1, s3, s4, s5 consumer ir s1, s3 (s4 and s5) (note 2) note 1: for lan and pme# signal, s5 is disabled by default in the bios setup program. setting this option to power on will enable a wake-up event from lan in the s5 state. note 2: wake from s4 and s5 is optional by the specification. note the use of these wake-up events from an acpi state requires an operating system that provides full acpi support. in additi on, software, drivers, and peripherals must fully support acpi wake events. 1.12.2 hardware support caution ensure that the power supply provides adeq uate +5 v standby current if lan wake capabilities and instantly available pc technolo gy features are used. failure to do so can damage the power supply. the total am ount of standby current required depends on the wake devices supported and manufacturing options. the board provides several power manage ment hardware features, including: ? power connector ? fan headers ? lan wake capabilities ? instantly available pc technology ? wake from usb ? pme# signal wake-up support ? wake# signal wake-up support ? wake from consumer ir lan wake capabilities and instantly available pc technology require power from the +5 v standby line.
product description 33 note the use of wake from usb from an acpi state requires an operating system that provides full acpi support. 1.12.2.1 power connector atx12v-compliant power supplies can turn off the system power through system control. when an acpi-enabled system receives the correct command, the power supply removes all non-standby voltages. when resuming from an ac power failure, th e computer returns to the power state it was in before power was interrupted (on or off). the computer?s response can be set using the last power state feature in th e bios setup program?s boot menu. for information about refer to the location of the main power connector figure 10, page 41 the signal names of the main power connector table 21, page 47 1.12.2.2 fan headers the function/operation of the fan headers is as follows: ? the fans are on when the board is in the s0 state. ? the fans are off when the board is off or in the s3, s4, or s5 state. ? the processor fan header is wired to a fan tachometer input. the front and rear fan headers each have independent tachometer input to the hardware monitoring and fan control device. all fan headers support closed-loop fan control that can adjust the fan speed according to thermal conditions. ? all fan headers have a +12 v dc connection. for information about refer to the location of the fan headers figure 10, page 41 the location of the fan headers an d sensors for thermal monitoring figure 6, page 28 the signal names of the fan headers section 0, page 40
intel desktop board DP45SG technical product specification 34 1.12.2.3 lan wake capabilities caution for lan wake capabilities, the +5 v standby line for the power supply must be capable of providing adequate +5 v standby current . failure to provide adequate standby current when implementing lan wake capa bilities can damage the power supply. lan wake capabilities enable remote wake-up of the computer through a network. the lan subsystem pci bus network adapter monitors network traffic at the media independent interface. upon detecting a magic packet* frame, the lan subsystem asserts a wake-up signal th at powers up the computer. depending on the lan implementation, the board supports lan wake capabilities with acpi in the following ways: ? the pci express wake# signal ? the pci bus pme# signal for pci 2.3 compliant lan designs ? by ping ? magic packet ? the onboard lan subsystem 1.12.2.4 instantly available pc technology caution for instantly available pc technology, th e +5 v standby line for the power supply must be capable of providing adequate +5 v standby current. failure to provide adequate standby current when implementing instantly available pc technology can damage the power supply. instantly available pc technology enables the board to enter the acpi s3 (suspend-to- ram) sleep-state. while in the s3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel led is amber if dual colored, or off if single colored.) when signaled by a wake-up device or event, the system quickly returns to its last known wake state. table 8 on page 32 lists the devices and events that can wake the computer from the s3 state. the board supports the pc i bus power management interface specification . add-in boards that also support this specificatio n can participate in power management and can be used to wake the computer. the use of instantly available pc technolo gy requires operating system support and pci 2.2 compliant add-in cards, pci express add-in cards, and drivers.
product description 35 1.12.2.5 wake from usb usb bus activity wakes the comput er from acpi s1 or s3 states. note wake from usb requires the use of a usb peripheral that supports wake from usb. 1.12.2.6 wake from cir consumer ir activity wakes the computer from acpi s1 and s3 state, and optionally from the acpi s4 and s5 state. 1.12.2.7 pme# signal wake-up support when the pme# signal on the pci conventi onal bus is asserted, the computer wakes from an acpi s1, s3, s4, or s5 state (w ith wake on pme enabled in the bios). 1.12.2.8 wake# signal wake-up support when the wake# signal on the pci express bus is asserted, the computer wakes from an acpi s1, s3, s4, or s5 state. 1.12.2.9 +5 v standby power indicator led and additional leds the +5 v standby power indicator led shows that power is still present even when the computer appears to be off. figure 7 shows the locati on of the standby power indicator led on the board. caution if ac power has been switched off and the standby power indicators are still lit, disconnect the power cord befo re installing or removing an y devices connected to the board. failure to do so could damage the board an d any attached devices. in addition to the standby power indicator, the board contains two leds that indicate the following: ? the processor led indicates an elevated temperature on the processor that could effect performance ? the voltage regulator led indicates an elevated temperature in the processor voltage regulator circuit that could effect performance figure 7 shows the location of these additional leds.
intel desktop board DP45SG technical product specification 36 figure 7. location of the standby power indicator led 1.12.3 energy star* in 2007, the us department of energy and the us environmental protection agency revised the energy star* requirements. in tel has worked directly with these two governmental agencies to define the new re quirements. currently this intel desktop board meets the new category c requirements. for information about refer to energy star requirements and recommended configurations http://www.intel.com/go/energystar
37 2 technical reference 2.1 memory resources 2.1.1 addressable memory the board utilizes 8 gb of addressable system memory. typically the address space that is allocated for pci conventional bu s add-in cards, pci express configuration space, bios (spi flash device), and chipse t overhead resides above the top of dram (total system memory). on a system that has 8 gb of system memory installed, it is not possible to use all of the installed me mory due to system address space being allocated for other system critical function s. these functions include the following: ? bios/spi flash device (32 mbit) ? local apic (19 mb) ? direct media interface (40 mb) ? front side bus interrupts (17 mb) ? pci express configuration space (256 mb) ? mch base address registers pc i express ports (up to 256 mb) ? memory-mapped i/o that is dynamically allocated for pci conventional and pci express add-in cards (256 mb) the board provides the capability to reclaim the physical memory overlapped by the memory mapped i/o logical address space. the board remaps physical memory from the top of usable dram boundary to the 4 gb boundary to an equivalent sized logical address range located just above the 4 gb boundary. figure 8 shows a schematic of the system memory map. all installed syst em memory can be used when there is no overlap of system addresses.
intel desktop board DP45SG technical product specification 38 figure 8. detailed system memory address map
technical reference 39 2.1.2 memory map table 9 lists the system memory map. table 9. system memory map address range (decimal) address range (hex) size description 1024 k - 8388608 k 100000 - 1ffffffff 8191 mb extended memory 960 k - 1024 k f0000 - fffff 64 kb runtime bios 896 k - 960 k e0000 - effff 64 kb reserved 800 k - 896 k c8000 - dffff 96 kb potential available high dos memory (open to the pci conventional bus). dependent on video adapter used. 640 k - 800 k a0000 - c7fff 160 kb video memory and bios 639 k - 640 k 9fc00 - 9ffff 1 kb extended bios data (movable by memory manager software) 512 k - 639 k 80000 - 9fbff 127 kb extended conventional memory 0 k - 512 k 00000 - 7ffff 512 kb conventional memory 2.2 connectors and headers caution only the following connectors and headers ha ve overcurrent protection: back panel and front panel usb, as well as ieee 1394. the other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computer ?s chassis, such as fans and internal peripherals. do not use these connectors or headers to power devices external to the computer?s chassis. a fault in the load pr esented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. furthermore, improper connection of usb or 1394 header single wire connectors may eventually overload the overcurrent protection and cause damage to the board. this section describes the board?s connector s. the connectors ca n be divided into these groups: ? back panel i/o connectors ? component-side i/o connectors and headers (see page 41)
intel desktop board DP45SG technical product specification 40 2.2.1 back panel connectors figure 9 shows the location of the back panel connectors for the intel desktop board DP45SG. item description a ieee-1394a connector b usb ports [2] c usb ports [2] d esata port e lan f usb ports [2] g center channel and lfe (subwoof er) audio out/ retasking jack g h rear surround left/right channel audio out i digital audio out optical j audio line in/side surround left/right channel audio out k front left/right channel audio out l mic in figure 9. back panel connectors note the back panel audio line out connector is designed to power headphones or amplified speakers only. poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
technical reference 41 2.2.2 component-side connectors and headers figure 10 shows the locations of the co mponent-side connectors and headers. figure 10. component-side connectors and headers table 10 lists the component-side co nnectors and headers identified in figure 10.
intel desktop board DP45SG technical product specification 42 table 10. component-side connectors and headers shown in figure 10 item/callout from figure 10 descript ion a pci conventional bus add-in card connector b s/pdif connector c pci conventional bus add-in card connector d pci conventional bus add-in card connector e pci express x16 bus add-in card connector f pci express x1 bus add-in card connector g ieee 1394a front panel header h pci express x1 bus add-in card connector i pci express x16 bus add-in card connector j auxiliary pci express graphics power k processor fan header l rear chassis fan header m processor core power connector (2 x 2) n main power connector o front chassis fan header p chassis intrusion header q auxiliary front panel power led header r front panel header s front panel cir receiver (input) header t serial ata connectors [5] u auxiliary chassis fan header v front panel usb header w front panel usb header x front panel usb header y high definition audio link header z serial header aa back panel cir emitter (output) header connector bb front panel audio header
technical reference 43 2.2.2.1 signal tables for the connectors and headers table 11. hd audio link header pin signal name pin signal name 1 bclk 2 ground 3 rst# 4 dvdd io 5 sync 6 ground 7 sdo 8 3.3 v dvdd core 9 sdi0 10 +12 v 11 sdi1 12 key (no pin) 13 not connected 14 3.3 v dual 15 not connected 16 ground table 12. front panel audio header pin signal name pin signal name 1 [port 1] left channel 2 ground 3 [port 1] right channel 4 presence# (dongle present) 5 [port 2] right channel 6 [port 1] sense_return 7 sense_send (jack detection) 8 key (no pin) 9 [port 2] left channel 10 [port 2] sense_return table 13. serial ata connectors pin signal name 1 ground 2 txp 3 txn 4 ground 5 rxn 6 rxp 7 ground table 14. serial port header pin signal name pin signal name 1 dcd (data carrier detect) 2 rxd# (receive data) 3 txd# (transmit data) 4 dtr (data terminal ready) 5 ground 6 dsr (data set ready) 7 rts (request to send) 8 cts (clear to send) 9 ri (ring indicato r) 10 key (no pin)
intel desktop board DP45SG technical product specification 44 table 15. chassis intrusion header pin signal name 1 intruder 2 ground table 16. front and rear chassis (3-pin) fan headers pin signal name 1 control (note) 2 +12 v 3 tach note: these fan headers use voltag e variance control for fan speed. table 17. processor and rear chassis 2 (4-pin) fan headers pin signal name 1 ground (note) 2 +12 v 3 fan_tach 4 fan_control note: these fan headers use pulse widt h modulation control for fan speed. table 20. back panel cir emitter (output) header pin signal name 1 emitter out 1 2 emitter out 2 3 ground 4 key (no pin) 5 jack detect 1 6 jack detect 2 table 21. front panel cir receiver (input) header pin signal name 1 ground 2 led 3 nc 4 learn-in 5 5 v standby 6 vcc 7 key (no pin) 8 cir input
technical reference 45 table 18. s/pdif connector pin signal name 1 vcc 2 s/pdif out 3 ground 2.2.2.2 add-in card connectors the board has the following add-in card connectors: ? pci express 2.0 x16: two pci express 2.0 x16 connectors ? supports pci express gen1 frequency of 1.25 ghz resulting in 2.5 gb/s each direction (500 mb/s total). maximum theo retical bandwidth on interface of 4 gb/s in each direction simultaneously , for an aggregate of 8 gb/s when operating in x16 mode. ? supports pci express gen2 frequency of 2.5 ghz resulting in 5.0 gb/s each direction (1000 mb/s total). maximum theo retical bandwidth on interface of 8 gb/s in each direction simultaneously , for an aggregate of 16 gb/s when operating in x16 mode. note if both pci express x16 slots are populated, the effective bandwidth will be at x8 for each slot. both cards must be pci express 2.0 compatible to achieve pci express 2.0 bandwidth. ? pci express x1: two pci express x1 connectors. ? the x1 interface supports simultaneous transfer speeds up to 250 mbytes/sec of peak bandwidth per direction an d up to 500 mbytes/sec concurrent bandwidth. ? pci conventional (rev 2.3 compliant) bus: three pci conventional bus add-in card connectors. ? the smbus is routed to all pc i conventional bus connectors . pci conventional bus add-in cards with smbus support can access sensor data and other information residing on the board. note the following considerations for the pci conventional bus connectors: ? all of the pci conventional bus co nnectors are bus master capable. ? smbus signals are routed to all pci conven tional bus connectors. this enables pci conventional bus add-in boards with smbu s support to access sensor data on the board. the specific smbus signals are as follows: ? the smbus clock line is connected to pin a40. ? the smbus data line is connected to pin a41.
intel desktop board DP45SG technical product specification 46 2.2.2.3 auxiliary front panel power/sleep led header pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header. table 19. auxiliary front panel power/sleep led header pin signal name in/out description 1 hdr_blnk_grn out front panel green led 2 not connected 3 hdr_blnk_yel out front panel yellow led 2.2.2.4 power supply connectors the board has the following power supply connectors: ? main power ? a 2 x 12 connector. this connector is compatible with 2 x 10 connectors previously used on intel desk top boards. the board supports the use of atx12v power supplies with either 2 x 10 or 2 x 12 main power cables. when using a power supply with a 2 x 10 main po wer cable, attach that cable on the rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24 unconnected. ? processor core power ? a 2 x 2 connector. this connector provides power directly to the processor voltage regulator and must always be used. failure to do so will prevent the board from booting. ? auxiliary pci express graphics power ? a 1 x 4 connector. this connector provides the required additional power wh en using high power (75 w or greater) add-in cards in either of the pci express x16 bus add-in card connectors. see figure 1 for location. caution if high power (75 w or greater) add-in cards are installed in either of the pci express x16 bus add-in card connectors, the auxilia ry pci express graphics power connector must be used. failure to do so may cause damage to the board and the add-in cards. furthermore, if you use a 2 x 10 power ca ble, you must also use the auxiliary pci express graphics power connector to ensure stable board operation. table 20. processor core power connector pin signal name pin signal name 1 ground 2 ground 3 +12 v 4 +12 v
technical reference 47 table 21. main power connector pin signal name pin signal name 1 +3.3 v 13 +3.3 v 2 +3.3 v 14 -12 v 3 ground 15 ground 4 +5 v 16 ps-on# (power supply remote on/off) 5 ground 17 ground 6 +5 v 18 ground 7 ground 19 ground 8 pwrgd (power good) 20 no connect 9 +5 v (standby) 21 +5 v 10 +12 v 22 +5 v 11 +12 v (note) 23 +5 v (note) 12 2 x 12 connector detect (note) 24 ground (note) note: when using a 2 x 10 power supply cable, this pin will be unconnected. table 22. auxiliary pci express graphics power pin signal name 1 +12 v 2 1 x 4 connector detect 3 ground 4 +5 v for information about refer to power supply considerations section 2.5.1 on page 53
intel desktop board DP45SG technical product specification 48 2.2.2.5 front panel header this section describes the functi ons of the front panel header. table 23 lists the signal names of the front panel header. figure 11 is a connection diagram for the front panel header. table 23. front panel header pin signal in/ out description pin signal in/ out description hard drive activity led power led 1 hd_pwr out hard disk led pull-up to +5 v 2 hdr_blnk_grn out front panel green led 3 hda# out hard disk active led 4 hdr_blnk_yel out front panel yellow led reset switch on/off switch 5 ground ground 6 fpbut_in in power switch 7 fp_reset# in reset switch 8 ground ground power not connected 9 +5 v power 10 n/c not connected figure 11. connection diagram for front panel header 2.2.2.5.1 hard drive activity led header pins 1 and 3 can be connected to an led to provide a visual indicator that data is being read from or written to a hard drive. proper led function requires one of the following: ? a serial ata hard drive or optical driv e connected to an onboard serial ata connector
technical reference 49 ? a parallel ata ide hard drive or optical drive connected to an onboard parallel ata ide connector 2.2.2.5.2 reset switch header pins 5 and 7 can be connected to a momentar y single pole, single throw (spst) type switch that is normally open. when the swit ch is closed, the board resets and runs the post. 2.2.2.5.3 power/sleep led header pins 2 and 4 can be connected to a one- or two-color led. table 24 shows the possible states for a one-color led. table 25 shows the possible states for a two-color led. table 24. states for a one-color power led led state description off power off/sleeping steady green running table 25. states for a two-color power led led state description off power off steady green running steady yellow sleeping note the colors listed in table 24 and table 25 are suggested colors only. actual led colors are chassis-specific. 2.2.2.5.4 power switch header pi ns 6 and 8 can be connected to a front panel momentary-contact power switch. the switch must pull the sw_on# pin to ground for at least 50 ms to signal the power supply to switch on or off. (the time requ irement is due to inte rnal debounce circuitry on the board.) at least two seconds must pass before the power supply will recognize another on/off signal.
intel desktop board DP45SG technical product specification 50 2.2.2.6 front panel usb headers figure 12 is a connection diagram for the front panel usb headers. # integrator?s notes ? the +5 v dc power on the usb headers is fused. ? use only a front panel usb connector that conforms to the usb 2.0 specification for high-speed usb devices. figure 12. connection diagram for front panel usb headers 2.2.2.7 front panel ieee 1394a header figure 13 is a connection diagram for the ieee 1394a header. # integrator?s notes ? the +12 v dc power on the ieee 1394a header is fused. ? the ieee 1394a header provides one ieee 1394a port. figure 13. connection diagram for ieee 1394a header
technical reference 51 2.3 jumper block caution do not move the jumper with the power on. always turn off the power and unplug the power cord from the computer before chan ging a jumper setting. otherwise, the board could be damaged. figure 14 shows the location of the jumper block. the 3- pin jumper block determines the bios setup program?s mode. table 26 describes the jumper settings for the three modes: normal , configure, and recovery. when the jumper is set to configure mode and the computer is powered-up, the bios compares the processor version and the microcode version in the bios and reports if the two match. figure 14. location of the jumper block table 26. bios setup configuration jumper settings function/mode jumper setting configuration normal 1-2 321 the bios uses current configuration information and passwords for booting. configure 2-3 321 after the post runs, setup runs automatically. the maintenance menu is displayed. recovery none 321 the bios attempts to recover the bios configuration. a recovery diskette is required.
intel desktop board DP45SG technical product specification 52 2.4 mechanical considerations 2.4.1 form factor the board is designed to fit into an atx-form-factor chassis. figure 15 illustrates the mech anical form factor for the board. dimensions are given in inches [millimeters]. the outer dimensions are 11.60 inches by 9.60 inches [294.60 millimeters by 243.84 millimeters]. location of the i/ o connectors and mounting holes are in compliance with the atx specification. figure 15. board dimensions
technical reference 53 2.5 electrical considerations 2.5.1 power supply considerations caution the +5 v standby line from the power supply must be capable of providing adequate +5 v standby current. failure to do so can damage the power supply. the total amount of standby current required depe nds on the wake devices supported and manufacturing options. additional power required will depend on configurations chosen by the integrator. the power supply must comply with the indi cated parameters of the atx form factor specification. ? the potential relation between 3.3 vdc and +5 vdc power rails ? the current capability of the +5 vsb line ? all timing parameters ? all voltage tolerances for example, for a system consisting of a supported 130 w processor (see section 1.4 on page 14 for a list of supported processors), 1 gb ddr3 ram, one high end video card, one hard disk drive, one optical driv e, and all board peripherals enabled, the minimum recommended power supply is 460 w. table 27 lists the recommended power supply current values. table 27. recommended power supply current values output voltage 3.3 v 5 v 12 v1 12 v2 -12 v 5 vsb current 22 a 20 a 16 a 16 a 0.3 a 1.5 a
intel desktop board DP45SG technical product specification 54 2.5.2 fan header current capability caution the processor fan must be connected to the processor fan header, not to a chassis fan header. connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. table 28 lists the current capability of the fan headers. table 28. fan header current capability fan header maximum available current processor fan 2.0 a front chassis fan 1.5 a rear chassis fan 1.5 a auxiliary rear chassis fan 2.0 a 2.5.3 add-in board considerations the board is designed to provide 2 a (avera ge) of current for each add-in board from the +5 v rail. the total +5 v current draw for add-in boards for a fully loaded board (all seven expansion slots filled) must not exceed the system?s power supply +5 v maximum current or 14 a in total. 2.6 thermal considerations caution a chassis with a maximum intern al ambient temperature of 38 o c at the processor fan inlet is a requirement. use a processor he at sink that provides omni-directional airflow to maintain required airflow ac ross the processor voltage regulator area. caution failure to ensure appropriate airflow may re sult in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. for a list of chassis that have been tested with intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm all responsibility for determining the adeq uacy of any thermal or system design remains solely with the reader. intel ma kes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.
technical reference 55 caution ensure that the ambient temperature does not exceed the board?s maximum operating temperature. failure to do so could cause components to exceed their maximum case temperature and malfunction. for info rmation about the maximum operating temperature, see the environmental specifications in section 2.7. caution ensure that proper airflow is maintained in the processor voltage regulator circuit. failure to do so may result in damage to the voltage regu lator circuit. the processor voltage regulator area (shown in figure 16) can reach a temperature of up to 85 o c in an open chassis.
intel desktop board DP45SG technical product specification 56 figure 16 shows the locations of the localized high temperature zones. item description a processor voltage regulator area b processor c intel 82p45 mch d intel 82801jr ich10r figure 16. localized high temperature zones table 29 provides maximum case temperatures for the components that are sensitive to thermal changes. the operating temperat ure, current load, or operating frequency could affect case temperat ures. maximum case temperatures are important when considering proper airflow to cool the board. table 29. thermal considerations for components component maximum case temperature processor for processor case temper ature, see processor datasheets and processor specification updates intel 82p45 mch 97 o c (under bias) intel 82801jr (ich10r) 92 o c (under bias)
technical reference 57 for information about refer to processor datasheets and spec ification updates section 1.3, page 14 intel p45 express chipset datash eets, specification updates, and design guides http://www.intel.com/pro ducts/chipsets/index.htm 2.7 reliability the mean time between failures (mtbf) pred iction is calculated using component and subassembly random failure rates. the calculation is based on the bellcore reliability prediction procedure, tr-nwt-000332, issue 4, september 1991. the mtbf prediction is used to estimate repair ra tes and spare parts requirements. the mtbf data is calculated from predicted data at 55 oc. the mtbf for this board will be provided in a motherboard specification update (msu) when available. 2.8 environmental table 30 lists the environmental specifications for the board. table 30. environmental specifications parameter specification temperature non-operating -20 c to +70 c operating 0 c to +55 c shock unpackaged 50 g trapezoidal waveform velocity change of 170 inches/second2 packaged half sine 2 millisecond product weight (pounds) free fall (inches) velocity change (inches/sec2) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 vibration unpackaged 5 hz to 20 hz: 0.01 g2 hz sloping up to 0.02 g2 hz 20 hz to 500 hz: 0.02 g2 hz (flat) packaged 5 hz to 40 hz: 0.015 g2 hz (flat) 40 hz to 500 hz: 0.015 g2 hz sloping down to 0.00015 g2 hz
intel desktop board DP45SG technical product specification 58
59 3 overview of bios features 3.1 introduction the board uses an intel bios that is stored in the serial periph eral interface flash memory (spi flash) and can be updated using a disk-based program. the spi flash contains the bios setup program, post, the pci auto-configuration utility, lan eeprom information, and plug and play support. the bios displays a message during post id entifying the type of bios and a revision code. the initial production bioss are identified as sgp4510h.86a. when the bios setup configuration jumper is set to configure mode and the computer is powered-up, the bios compares the cpu version and the microcode version in the bios and reports if the two match. the bios setup program can be used to view and change the bios settings for the computer. the bios setup program is acce ssed by pressing the key after the power-on self-test (post) memory test begi ns and before the operating system boot begins. the menu bar is shown below. maintenance main advanced performance security power boot exit note the maintenance menu is displayed only when the board is in configure mode. section 2.3 on page 51 shows how to put the board in configure mode.
intel desktop board DP45SG technical product specification 60 table 31 lists the bios setup program menu features. table 31. bios setup program menu bar maintenance main advanced perfor mance security power boot exit clears passwords and displays processor information displays processor and memory configura- tion configures advanced features available through the chipset configures memory, bus and processor overrides sets passwords and security features configures power management features and power supply controls selects boot options saves or discards changes to setup program options table 32 lists the function ke ys available for menu screens. table 32. bios setup program function keys bios setup program function key description < > or < > selects a different menu screen (mov es the cursor left or right) < > or < > selects an item (moves the cursor up or down) selects a field (not implemented) executes command or selects the submenu load the default configurat ion values for the current menu save the current values and exits the bios setup program exits the menu 3.2 bios flash memory organization the serial peripheral inte rface flash memory (spi flash) includes an 32 mbit (4096 kb) flash memory device 3.3 resource configuration 3.3.1 pci autoconfiguration the bios can automatically configure pci de vices. pci devices may be onboard or add-in cards. autoconfiguration lets a user insert or remove pc i cards without having to configure the system. when a user turns on the system after adding a pci card, the bios automatically configures interru pts, the i/o space, and other system resources. any interrupts set to available in setup are considered to be available for use by the add-in card.
overview of bios features 61 3.4 system management bios (smbios) smbios is a desktop management interfac e (dmi) compliant method for managing computers in a managed network. the main component of smbios is the management information format (mif) database, which contains information about the computing system and its components. using smbios, a system admi nistrator can obtain the system types, capabilities, operational status, and installation dates for system components. the mif database defines the data and provides th e method for accessing this information. the bios enables applications such as third-party management software to use smbios. the bios stores and report s the following smbios information: ? bios data, such as the bios revision level ? fixed-system data, such as peripher als, serial numbers , and asset tags ? resource data, such as memory si ze, cache size, and processor speed ? dynamic data, such as event detection and error logging non-plug and play operating systems require an additional interface for obtaining the smbios information. the bios supports an smbios table interface for such operating systems. using this support, an smbios service-level application running on a non-plug and play operating system can obtain the smbios information. additional board information can be found in the bios under the additional information header under the main bios page. 3.5 legacy usb support legacy usb support enables usb devices to be used even when the operating system?s usb drivers are not yet available. legacy usb support is used to access the bios setup program, and to install an op erating system that supports usb. by default, legacy usb suppo rt is set to enabled. legacy usb support operates as follows: 1. when you apply power to the comput er, legacy support is disabled. 2. post begins. 3. legacy usb support is enabled by the bios allowing you to use a usb keyboard to enter and configure the bios setup program and the maintenance menu. 4. post completes. 5. the operating system loads. while the operating system is loading, usb keyboards and mice are recognized and ma y be used to configure the operating system. (keyboards and mice are not recogn ized during this period if legacy usb support was set to disabled in the bios setup program.) 6. after the operating system loads the usb drivers, all legacy and non-legacy usb devices are recognized by the operating system, and legacy usb support from the bios is no longer used. 7. additional usb legacy feat ure options can be access by using intel integrator toolkit.
intel desktop board DP45SG technical product specification 62 to install an operating system that supports usb, verify that legacy usb support in the bios setup program is set to enabled and follow the operating system?s installation instructions. 3.6 bios updates the bios can be updated using either of the following utilities, which are available on the intel world wide web site: ? intel ? express bios update utility, which enables automated updating while in the windows environment. using this utility, the bios can be updated from a file on a hard disk, a usb drive (a flash drive or a usb hard drive), or a cd-rom, or from the file location on the web. ? intel ? flash memory update utility, which requires booting from dos. using this utility, the bios can be updated from a file on a hard disk, a usb drive (a flash drive or a usb hard drive), or a cd-rom. both utilities verify that the updated bios matches the target system to prevent accidentally installing an incompatible bios. note review the instructions distributed with th e upgrade utility before attempting a bios update. for information about refer to bios update utilities http://support.intel.com/support/motherboards/desktop/sb /cs-022312.htm . 3.6.1 language support the bios setup program and help messages ar e supported in us english. additional languages are available in the integrator toolkit utility. check the intel website for details.
overview of bios features 63 3.6.2 custom splash screen during post, an intel ? splash screen is displayed by de fault. this splash screen can be augmented with a custom splash screen. the intel ? integrator toolkit or intel ? integrator assistant that are available from intel can be used to create a custom splash screen. note if you add a custom splash screen, it will share space with the intel branded logo. for information about refer to intel ? integrator toolkit http://developer.intel.com/des ign/mo therbd/software/itk/ additional intel software tools http://developer.intel.com/products/motherboard/DP45SG/ tools.htm and http://developer.intel.com/d esign/mo therbd/software.htm 3.7 bios recovery it is unlikely that anything will interrupt a bios update; however, if an interruption occurs, the bios could be damaged. table 33 lists the drives and media types that can and cannot be used for bios recovery. the bios recovery media does not need to be made bootable. table 33. acceptable drives/media types for bios recovery media type can be used for bios recovery? cd-rom drive connected to the serial ata interface yes usb removable drive (a usb flash drive, for example) yes usb diskette drive (with a 1.44 mb diskette) no usb hard disk drive no for information about refer to bios recovery http://support.intel.com/support/motherboards/desktop/ sb/cs-023360.htm
intel desktop board DP45SG technical product specification 64 3.8 boot options in the bios setup program, the user can ch oose to boot from a diskette drive, hard drive, usb drive, usb flash drive, cd-rom, or the network. the default setting is for the diskette drive to be the first boot de vice, the hard drive second, and the atapi cd-rom third. if enabled, the last default boot device is the network. 3.8.1 cd-rom boot booting from cd-rom is supported in compliance to the el torito bootable cd-rom format specification. under the boot me nu in the bios setup program, atapi cd- rom is listed as a boot device. boot devices are defined in pr iority order. accordingly, if there is not a bootable cd in the cd-rom drive, the system will attempt to boot from the next defined drive. 3.8.2 network boot the network can be selected as a boot device. this selection allows booting from the onboard lan or a network add-in card with a remote boot rom installed. pressing the key during post automati cally forces booting from the lan. to use this key during post, the user access le vel in the bios setup program's security menu must be set to full. 3.8.3 booting without attached devices for use in embedded applications, the bios has been designed so that after passing the post, the operating system loader is in voked even if the following devices are not present: ? video adapter ? keyboard ? mouse 3.8.4 changing the default boot device during post pressing the key during post causes a boot device menu to be displayed. this menu displays the list of available boot de vices (as set in the bios setup program?s boot device priority submenu). table 34 lists the boot device menu options. table 34. boot device menu options boot device menu function keys description < > or < > selects a default boot device exits the menu, saves changes, and boots from the selected device exits the menu without saving changes
overview of bios features 65 3.9 adjusting boot speed these factors affect system boot speed: ? selecting and configuring peripherals properly ? optimized bios boot parameters 3.9.1 peripheral selection and configuration the following techniques help improve system boot speed: ? choose a hard drive with parameters such as ?power-up to data ready? less than eight seconds, that minimize hard drive startup delays. ? select a cd-rom drive with a fast initialization rate. this rate can influence post execution time. ? eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode changes in post. th ese features may add time to the boot process. ? try different monitors. some monitors initialize and communicate with the bios more quickly, which enables the system to boot more quickly. 3.9.2 bios boot optimizations use of the following bios setup program se ttings reduces the post execution time. ? in the boot menu, set the hard disk drive as the first boot device. as a result, the post does not first seek a diskette driv e, which saves about one second from the post execution time. ? in the peripheral configuration submenu, disable the lan device if it will not be used. this can reduce up to four seconds of option rom boot time. note it is possible to optimize the boot process to the point where the system boots so quickly that the intel logo screen (or a cust om logo splash screen) will not be seen. monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screen s and post messages cannot be seen. this boot time may be so fast that some drives might be no t be initialized at all. if this condition should occur, it is possibl e to introduce a programmable delay ranging from zero to 30 seconds by 5 second incr ements (using the hard disk pre-delay feature of the advanced menu in the drive configuration submenu of the bios setup program).
intel desktop board DP45SG technical product specification 66 3.10 bios security features the bios includes security features that restrict access to the bios setup program and who can boot the computer. a superv isor password and a user password can be set for the bios setup program and for booting the computer, with the following restrictions: ? the supervisor password gives unrestricte d access to view and change all the setup options in the bios setup program. this is the supervisor mode. ? the user password gives restri cted access to view and ch ange setup options in the bios setup program. this is the user mode. ? if only the supervisor password is set, pressing the key at the password prompt of the bios setup program allows the user restricted access to setup. ? if both the supervisor and user passwor ds are set, users can enter either the supervisor password or the user password to access setup. users have access to setup respective to which password is entered. ? setting the user password restricts who can boot the computer. the password prompt will be displayed before the computer is booted. if only the supervisor password is set, the computer boots with out asking for a password. if both passwords are set, the user can enter ei ther password to boot the computer. ? for enhanced security, use different pa sswords for the supervisor and user passwords. ? valid password characters are a-z, a-z, and 0-9. passwords may be up to 16 characters in length. table 35 shows the effects of setting the supervisor password and user password. t his table is for reference only and is not displayed on the screen. table 35. supervisor and user password functions password set supervisor mode user mode setup options password to enter setup password during boot neither can change all options (note) can change all options (note) none none none supervisor only can change all options can change a limited number of options supervisor password supervisor none user only n/a can change all options enter password clear user password user user supervisor and user set can change all options can change a limited number of options supervisor password enter password supervisor or user supervisor or user note: if no password is set, any us er can change all setup options.
67 4 error messages and beep codes 4.1 speaker the board-mounted speaker provides audi ble error code (beep code) information during post. for information about refer to the location of the onboard speaker figure 1, page 11 4.2 bios beep codes whenever a recoverable error occurs duri ng post, the bios causes the board?s speaker to beep an error message describing the problem (see table 36). table 36. beep codes type pattern frequency memory error three long beeps 1280 hz thermal warning four alternating beeps: high tone, low tone, high tone, low tone high tone: 2000 hz low tone: 1600 hz 4.3 bios error messages whenever a recoverable error occurs duri ng post, the bios displays an error message describing the problem. table 37 lists the error messages and provides a brief description of each. table 37. bios error messages error message explanation cmos battery low the battery may be losing power. replace the battery soon. cmos checksum bad the cmos checksum is incorrect. cmos memory may have been corrupted. run setup to reset values. memory size decreased memory size has decr eased since the last boot. if no memory was removed, then memory may be bad. no boot device available system did not find a device to boot.
intel desktop board DP45SG technical product specification 68 4.4 port 80h post codes during the post, the bios generates diagno stic progress codes (post codes) to i/o port 80h. if the post fails, execution stops and the last post code generated is left at port 80h. this code is useful for de termining the point wher e an error occurred. displaying the post codes requires a pci bu s add-in card, often called a post card. the post card can decode the port and disp lay the contents on a medium such as a seven-segment display. note the post card must be installed in pci bus connector 1. the following tables provide information about the post codes generated by the bios: ? table 38 lists the port 80h post code ranges ? table 39 lists the port 80h post codes themselves ? table 40 lists the port 80h post sequence note in the tables listed above, all post codes and range values are listed in hexadecimal. table 38. port 80h post code ranges range category/subsystem 00 ? 0f debug codes: can be used by any peim/driver for debug. 10 ? 1f host processors: 1f is an unrecoverable cpu error. 20 ? 2f memory/chipset: 2f is no memory detected or no useful memory detected. 30 ? 3f recovery: 3f indicated recovery failure. 40 ? 4f reserved for future use. 50 ? 5f i/o busses: pci, usb, ata, etc. 5f is an unrecoverable error. start with pci. 60 ? 6f reserved for future use (for new busses). 70 ? 7f output devices: all output co nsoles. 7f is an unrecoverable error. 80 ? 8f reserved for future us e (new output console codes). 90 ? 9f input devices: keyboard/mouse . 9f is an unrecoverable error. a0 ? af reserved for future use (new input console codes). b0 ? bf boot devices: includes fixed media and removable media. bf is an unrecoverable error. c0 ? cf reserved for future use. d0 ? df boot device selection. e0 ? ff e0 ? ee: miscellaneous codes. see table 39. ef : boot/s3 resume failure. f0 ? ff: ff processor exception.
error messages and beep codes 69 table 39. port 80h post codes post code description of post operation host processor 10 power-on initialization of the host processor (boot strap processor) 11 host processor cache initialization (including aps) 12 starting application processor initialization 13 smm initialization chipset 21 initializing a chipset component memory 22 reading spd from memory dimms 23 detecting presence of memory dimms 24 programming timing parameters in the memory controller and the dimms 25 configuring memory 26 optimizing memory settings 27 initializing memory, such as ecc init 29 memory testing completed pci bus 50 enumerating pci busses 51 allocating resources to pci bus 52 hot plug pci controller initialization 53 ? 57 reserved for pci bus usb 58 resetting usb bus 59 reserved for usb ata/atapi/sata 5a resetting pata/sata bus and all devices 5b reserved for ata smbus 5c resetting smbus 5d reserved for smbus local console 70 resetting the vga controller 71 disabling the vga controller 72 enabling the vga controller remote console 78 resetting the console controller 79 disabling the console controller 7a enabling the console controller continued
intel desktop board DP45SG technical product specification 70 table 39. port 80h post codes (continued) post code description of post operation keyboard (usb) 90 resetting keyboard 91 disabling keyboard 92 detecting presence of keyboard 93 enabling the keyboard 94 clearing keyboard input buffer 95 instructing keyboard controller to run self test (ps/2 only) mouse (usb) 98 resetting mouse 99 disabling mouse 9a detecting presence of mouse 9b enabling mouse fixed media b0 resetting fixed media b1 disabling fixed media b2 detecting presence of a fixed me dia (ide hard drive detection etc.) b3 enabling/configuring a fixed media removable media b8 resetting removable media b9 disabling removable media ba detecting presence of a removable media (ide, cd-rom detection, etc.) bc enabling/configuring a removable media bds d y trying boot selection y (y=0 to 15) pei core e0 started dispatching peims (emitted on first report of efi_sw_pc_init_begin efi_sw_pei_pc_handoff_to_next) e2 permanent memory found e1, e3 reserved for pei/peims dxe core e4 entered dxe phase e5 started dispatching drivers e6 started connecting drivers continued
error messages and beep codes 71 table 39. port 80h post codes (continued) post code description of post operation dxe drivers e7 waiting for user input e8 checking password e9 entering bios setup eb calling legacy option roms runtime phase/efi os boot f4 entering sleep state f5 exiting sleep state f8 efi boot service exitbootservices ( ) has been called f9 efi runtime service setvirtual addressmap ( ) has been called fa efi runtime service resetsystem ( ) has been called peims/recovery 30 crisis recovery has initiated per user request 31 crisis recovery has initiated by software (corrupt flash) 34 loading recovery capsule 35 handing off control to the recovery capsule 3f unable to recover
intel desktop board DP45SG technical product specification 72 table 40. typical port 80h post sequence post code description 21 initializing a chipset component 22 reading spd from memory dimms 23 detecting presence of memory dimms 25 configuring memory 28 testing memory 34 loading recovery capsule e4 entered dxe phase 12 starting application processor initialization 13 smm initialization 50 enumerating pci busses 51 allocating resourced to pci bus 92 detecting the presence of the keyboard 90 resetting keyboard 94 clearing keyboard input buffer 95 keyboard self test eb calling video bios 58 resetting usb bus 5a resetting pata/sata bus and all devices 92 detecting the presence of the keyboard 90 resetting keyboard 94 clearing keyboard input buffer 5a resetting pata/sata bus and all devices 28 testing memory 90 resetting keyboard 94 clearing keyboard input buffer e7 waiting for user input 01 int 19 00 ready to boot
73 5 regulatory compliance and battery disposal information 5.1 regulatory compliance this section contains the following regulatory compliance information for intel desktop board DP45SG: ? safety standards ? european union declaration of conformity statement ? product ecology statements ? electromagnetic compatibility (emc) standards ? product certification markings 5.1.1 safety standards intel desktop board DP45SG complies with the safety standards stated in table 41 w hen correctly installed in a compatible host system. table 41. safety standards standard title csa/ul 60950-1, first edition information technology equipment ? safety - part 1: general requirements (usa and canada) en 60950-1:2006, second edition information technology equipmen t ? safety - part 1: general requirements (european union) iec 60950-1:2005, second edition information technology equipmen t ? safety - part 1: general requirements (international)
intel desktop board DP45SG technical product specification 74 5.1.2 european union declaration of conformity statement we, intel corporation, declare under our sole responsibility that the product intel ? desktop board DP45SG is in co nformity with all applicab le essential requirements necessary for ce marking, following the provisions of the european council directive 2004/108/ec (emc directive) and 2006/ 95/ec (low voltage directive). the product is properly ce marked demo nstrating this conformity and is for distribution within all member states of the eu with no restrictions. this product follows the provisions of the european directives 2004/108/ec and 2006/95/ec. ? e?tina tento vyrobek odpovd po?adavk ? m evropskych sm rnic 2004/108/ec a 2006/95/ec. dansk dette produkt er i overensstemmels e med det europ?iske direktiv 2004/108/ec & 2006/95/ec. dutch dit product is in navolging van de bepalingen van europees directief 2004/108/ec & 2006/95/ec. eesti antud toode vastab euroopa direktiivides 2004/108/ec ja 2006/95/ec kehtestatud n?uetele. suomi t?m? tuote noudattaa eu-direktiivin 2004/108/ec & 2006/95/ec m??r?yksi?. fran?ais ce produit est conforme aux exigen ces de la directive europenne 2004/108/ec & 2006/95/ec. deutsch dieses produkt entspricht den bestimm ungen der europ?ischen richtlinie 2004/108/ec & 2006/95/ec. ??????? ? ? ??? ??????? ?? ????? ?? ?????? ????? 2004/108/ec ? 2006/95/ec. magyar e termk megfelel a 2004/108/ec s 2006/95/ec eurpai irnyelv el ? rsainak. icelandic tessi vara stenst reglugere evrps ka efnahags bandalagsins nmer 2004/108/ec & 2006/95/ec. italiano questo prodotto conforme a lla direttiva europea 2004/108/ec & 2006/95/ec. latvie?u ?is produkts atbilst eiropas direkt vu 2004/108/ec un 2006/95/ec noteikumiem. lietuvi? ?is produktas atitinka europos direktyv ? 2004/108/ec ir 2006/95/ec nuostatas. malti dan il-prodott hu konformi mal-pr ovvedimenti tad-direttivi ewropej 2004/108/ec u 2006/95/ec. norsk dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/ec & 2006/95/ec. polski niniejszy produkt jest zgodny z postan owieniami dyrektyw unii europejskiej 2004/108/ec i 73/23/ewg. portuguese este produto cumpre com as norm as da diretiva europia 2004/108/ec & 2006/95/ec.
regulatory compliance and battery disposal information 75 espa?ol este producto cumple con las norm as del directivo europeo 2004/108/ec & 2006/95/ec. slovensky tento produkt je v slade s us tanoveniami eurpskych direktv 2004/108/ec a 2006/95/ec. sloven? ? ina izdelek je skladen z dolo ?bami evropskih direktiv 2004/108/ec in 2006/95/ec. svenska denna produkt har tillverkats i enlighet med eg-direktiv 2004/108/ec & 2006/95/ec. trk?e bu rn, avrupa birli ?i?nin 2004/108/ec ve 2006/95/ec y?nergelerine uyar. 5.1.3 product ecology statements the following information is provided to address worldwide product ecology concerns and regulations. 5.1.3.1 disposal considerations this product contains the following material s that may be regulated upon disposal: lead solder on the printed wiring board assembly. 5.1.3.2 recycling considerations as part of its commitment to environmental responsibility, intel has implemented the intel product recycling program to allow retail consumers of intel?s branded products to return used products to selected locations for proper recycling. please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. ?????????? intel product recycling program ????????????????? ????? http://www.intel.com/intel/other/ehs/product_ecology ????p??????? deutsch als teil von intels engagement fr den um weltschutz hat das unternehmen das intel produkt-recyclingprogramm implementiert, das einzelhandelskunden von intel markenprodukten erm?glicht, gebrauchte produkte an ausgew ?hlte standorte fr ordnungsgem??es recycling zurckzugeben. details zu diesem programm, einschlie? lich der darin eingeschlossenen produkte, verfgbaren standorte, versandanweisungen , bedingungen usw., finden sie auf der http://www.intel.com/intel/other/ehs/product_ecology
intel desktop board DP45SG technical product specification 76 espa?ol como parte de su compromiso de responsabilidad medioambiental, intel ha implantado el programa de reciclaje de productos intel, que permite que los consumidores al detalle de los productos intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envo, trm inos y condiciones, etc. fran?ais dans le cadre de son engagement pour la protection de l'environnement, intel a mis en ?uvre le programme intel product recy cling program (programme de recyclage des produits intel) pour pe rmettre aux consommateurs de produits intel de recycler les produits uss en les retour nant des adresses spcifies. visitez la page web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, savoir les produits concerns, les adresses disponibles, les instructions d'expdition, les cond itions gnrales, etc. ?Z ???ho??h???K? ?u???????m??u?? ??k?? u????s????? http://www.intel.com/in tel/other/ehs/product_ecology ?ZE malay sebagai sebahagian daripada komitmennya terhadap ta nggungjawab persekitaran, intel telah melaksanakan program kita r semula produk untuk membenarkan pengguna-pengguna runcit produk jenama intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb. portuguese como parte deste compromisso com o respei to ao ambiente, a intel implementou o programa de reciclagem de produtos para que os consumidores finais possam enviar produtos intel usados para locais selecionad os, onde esses produtos s?o reciclados de maneira adequada. consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em ingls) para obter os detalhes sobre este programa , inclusive o escopo dos produtos cobertos, os locais disponveis, as instru??es de envio, os termos e condi??es, etc.
regulatory compliance and battery disposal information 77 russian ???? ? ?? ????? ???? ?? , intel ???? ???? ?????? ??? intel (product recycling program) ?? ???????? ???? ?????? ?? ??? intel ????? ???? ????? ??? ??????????? ?? ?? ???? ??????. ???? , ???? ? ?? - ?? http://www.intel.com/intel/other/ehs/product_ecology ? ?????? ???? , ??????? ??? , ??? ???, ???? ??? , ????? ??? . . trk?e intel, ?evre sorumlulu?una ba ? ml l ? n n bir par?as olarak, perakend e tketicilerin intel markal kullan lm ? rnlerini belirlenmi ? merkezlere iade edip uygun ?ekilde geri d?n ? trmesini ama?layan intel rnleri geri d?n ?m program ?n uygulamaya koymu ?tur. bu program n rn kapsam , rn iade merkezleri, nakliye talimatlar , kay tlar ve ?artlar v.s dahil btn ayr nt lar n ?grenmek i?in ltfen http://www.intel.com/intel/other/ehs/product_ecology web sayfas na gidin. 5.1.3.3 lead free desktop board this desktop board is a european union restriction of hazardous substances (eu rohs directive 2002/95/ec) compliant product. eu rohs restricts the use of six materials. one of the six re stricted materials is lead. this desktop board is lead free although certain discrete components used on the board contain a small amount of lead whic h is necessary for component performance and/or reliability. this desktop board is referred to as ?lead-free second level interconnect.? the board substrate and the solder connections from the board to the components (second-level connections) are all lead free. china bans the same substances and has the same limits as eu rohs; however it requires different product marking and contro lled substance information. the required mark shows the environmental friendly usage period (efup). the efup is defined as the number of years for which controlled listed substances will not leak or chemically deteriorate while in the product. table 42 shows the various forms of the ?lead-free 2 nd level interconnect? mark as it appears on the board and accompanying collateral.
intel desktop board DP45SG technical product specification 78 table 42. lead-free board markings description mark lead-free 2 nd level interconnect: this symbol is used to identify electrical and electronic assemblies and components in which the lead (pb) concentration level in the desktop board substrate and the solder connections from the board to the components (second-level interconnect) is not greater than 0.1% by weight (1000 ppm). or or
regulatory compliance and battery disposal information 79 5.1.4 emc regulations intel desktop board DP45SG complies wi th the emc regulations stated in table 43 w hen correctly installed in a compatible host system. table 43. emc regulations regulation title fcc 47 cfr part 15, subpart b title 47 of the code of federal regu lations, part15, subpart b, radio frequency devices. (usa) ices-003 issue 4 (class b) interference-causing equipment standard, digital apparatus. (canada) en55022:2006 (class b) limits and methods of measurement of radio interference characteristics of information technology equi pment. (european union) en55024:1998 (class b) information technology equipment ? i mmunity characteristics limits and methods of measurement. (european union) en55022:2006 (class b) australian communications authority, standard for electromagnetic compatibility. (australia and new zealand) cispr 22:2005 +a1:2005 +a2:2006 (class b) limits and methods of measurement of radio disturbance characteristics of information technology equi pment. (international) cispr 24:1997 +a1:2001 +a2:2002 (class b) information technology equipment ? i mmunity characteristics ? limits and methods of measurement. (international) vcci v-3/2007.04, v-4/2007.04, class b voluntary control for interference by information technology equipment. (japan) japanese kanji statement translation: this is a class b product based on the standard of the voluntary control council for inte rference from information technology equipment (vcci). if this is used near a radio or television receiver in a domestic environment, it may cause radio interf erence. install and use the equipment according to the instruction manual.
intel desktop board DP45SG technical product specification 80 korean class b statement translation: this is household equipment that is certified to comply with emc requirements. you may use this equipment in residential environments and other non-residential environments. 5.1.5 product certification markings (board level) intel desktop board DP45SG has the prod uct certification markings shown in table 44: table 44. product certification markings description mark ul joint us/canada recognized component mark. includes adjacent ul file number for intel desktop boards: e210882. fcc declaration of conformi ty logo mark for class b equipment. includes intel name and DP45SG model designation. ce mark. declaring compliance to european union (eu) emc directive and low voltage directive. australian communications authority (a ca) and new zealand radio spectrum management (nz rsm) c-tick mark. includes adjacent intel supplier code number, n-232. japan vcci (voluntary control council for interference) mark. s. korea mic (ministry of information and communication) mark. includes adjacent mic certification number: cpu-DP45SG (b) taiwan bsmi (bureau of standards, metrology and inspections) mark. includes adjacent intel company number, d33025. printed wiring board manufacturer?s reco gnition mark. consists of a unique ul recognized manufacturer?s logo, along with a flammability rating (solder side). v-0 china rohs/environmentally friendly use period logo: this is an example of the symbol used on intel desktop boards and associated collateral. the color of the mark may vary depending upon the application. the environmental friendly usage period (efup) for intel desktop boards has been determined to be 10 years.
regulatory compliance and battery disposal information 81 5.2 battery disposal information caution risk of explosion if the battery is replaced with an incorrect type. batteries should be recycled where possible. disposal of used batteries must be in accordance with local environmental regulations. precaution risque d'explosion si la pile usage est remp lace par une pile de type incorrect. les piles usages doivent tre recycles dans la mesure du possible. la mise au rebut des piles usages doit respecter les rglementa tions locales en vigueur en matire de protection de l'environnement. forholdsregel eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. batterier b?r om muligt genbruges. bortskaffels e af brugte batterier b?r foreg? i overensstemmelse med g?ldende milj?lovgivning. obs! det kan oppst? eksplosjonsfare hvis batteriet skiftes ut med feil type . brukte batterier b?r kastes i henhold til gjeldende milj?lovgivning. viktigt! risk f?r explosion om batteriet ers?tts med felaktig batterityp. batterier ska kasseras enligt de lokala milj ?v?rdsbest?mmelserna. varo r?j?hdysvaara, jos pariston tyyppi on v??r?. paristot on kierr?tett?v?, jos se on mahdollista. k?ytetyt paristot on h?vi tett?v? paikallisten ymp?rist?m??r?ysten mukaisesti. vorsicht bei falschem einsetzen einer neuen batteri e besteht explosionsgefahr. die batterie darf nur durch denselben oder einen en tsprechenden, vom hersteller empfohlenen batterietyp ersetzt werden. entsorgen si e verbrauchte batterien den anweisungen des herstellers entsprechend. avvertimento esiste il pericolo di un esplos ione se la pila non viene so stituita in modo corretto. utilizzare solo pile uguali o di tipo equivalente a quelle co nsigliate dal produttore. per disfarsi delle pile usate, seguir e le istruzioni del produttore.
intel desktop board DP45SG technical product specification 82 precaucin existe peligro de explosin si la pila no se cambia de forma adecuada. utilice solamente pilas iguales o del mismo tipo qu e las recomendadas por el fabricante del equipo. para deshacerse de las pilas usad as, siga igualmente las instrucciones del fabricante. waarschuwing er bestaat ontploffingsgevaar als de batteri j wordt vervangen door een onjuist type batterij. batterijen moeten zoveel moge lijk worden gerecycled. houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving. aten??o haver risco de explos?o se a bateria for su bstituda por um tipo de bateria incorreto. as baterias devem ser recicladas nos locais apropriados. a elimina??o de baterias usadas deve ser feita de acordo com as regulamenta??es ambientais da regi?o. a ? ciaro?zna ?? ?? ?? ?? , ??? ??????? ????? ???????? . ????? ???? , ?????? , ?????? . ????? ? ? ?????? ??? ???? ?? ?????????? ????? . upozornn v p ? pad vym ny baterie za nesprvny druh m ? ?e dojt k vybuchu. je-li to mo?n, baterie by m ly byt recyklovny. baterie je t ? eba zlikvidovat v souladu s mstnmi p? edpisy o ?ivotnm prost ? ed. ????? ????? ?????? ?? ???? ? ????? ? ??? ????????? ? ? ??????? ??. ? ???? ? ?? ? ????????? ?? ?? ???? ?? ???? . ????? ?? ????????????? ???? ?? ? ???? ????? ? ??? ?? ? ???|????????? ????????? . vigyazat ha a telepet nem a megfelel ? tpus telepre cserli, az felrobbanhat. a telepeket lehet ? sg szerint jra kell hasznostani. a hasznlt telepeke t a helyi k?rnyezetvdelmi el ? rsoknak megfelel ? en kell kiselejtezni.
regulatory compliance and battery disposal information 83 awas risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. bateri sepatutnya dikitar semula jika boleh. pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. ostrze ? enie istnieje niebezpiecze stwo wybuchu w przypadku zastosowania niew ? a ?ciwego typu baterii. zu ? yte baterie nale ? y w miar ? mo ? liwo ?ci utylizowa ? zgodnie z odpowiednimi przepisami ochrony ?rodowiska. precau ? ie risc de explozie, dac ? bateria este ?nlocuit ? cu un tip de baterie necorespunz ? tor. bateriile trebuie reciclate, dac ? este posibil. depozitarea bateriilor uzate trebuie s ? respecte reglement ? rile locale privind protec ? ia mediului. ??????? ??????? ???? ??????? ? ??? ? ? ???. ???? ???? ? ???????? ????? . ?????? ???? ???? ??? ????? , ???? ??? ?????? . upozornenie ak batriu vymente za nesp rvny typ, hroz nebezpe ?enstvo jej vybuchu. batrie by sa mali pod ? a mo?nosti v?dy recyklova ? . likvidcia pou?itych batri sa mus vykonva ? v slade s miestnymi predpismi na ochranu ?ivotnho prostredia. pozor zamenjava baterije z baterijo druga ?nega tipa lahko povzro ?i eksplozijo. ? e je mogo ?e, baterije reciklirajte. rabljene bate rije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi. . uyari yanl ? trde pil tak ld ? nda patlama riski vard r. piller mmkn oldu? unda geri d?n ?trlmelidir. kullan lm ? piller, yerel ?evre yasalar na uygun olarak at lmal d r. o ? ?????? ???? ?????? ? , ???? ?????? ??? ???. ? ????? , ?????? ???? ? ?????. ????? ??????? ???? ?? ? ?????? ???? ???? ? , ??? ? ????? .
intel desktop board DP45SG technical product specification 84

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